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| 搜索工作首页 > 英飞特电子(杭州)有限公司 > IC封装管理 |
IC封装管理 |
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| IC封装管理职位说明及要求 | |
职位描述: 1.与设计工程师,封装厂协作正确设计芯片封装,保证芯片性能,降低封装成本 2.熟悉常见芯片封装中的可靠性与测试问题 3.与封装厂协调以保证样片,产品的及时交付 职位要求: 1.本科学历,具备3年以上相关工作经验;或硕士学历有1年以上相关工作经验 2.熟悉模拟以及功率芯片封装 3.具有良好的沟通能力以及项目管理能力 4.有多家封装厂合作经验者优先 Work with design team and assembly house to properly design IC packaging to achieve good performance and low cost. Must understand the reliability and test issue associated with commonly seen IC packages. Can effectively manage the assembly vendors to meet delivery schedules of engineering samples and released products. Requirements: Minimum requirements: >3 years with BSEE or 1 year with MSEE Previous experience with analog or power component packaging is required Must have good communication skills and project management capability. Previous experience with multiple assembly vendors is required. |
| 英飞特电子(杭州)有限公司地址和其它联系方式 | |
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公司地址:杭州市滨江区东信大道66号东方通信城中试楼A105 邮政编码: 电子邮箱:yftzp@yahoo.com.cn 公司网址: |